Samsung wins $200 billion order to supply AI chips to Broadcom

1:28 PM · July 27, 2026

Samsung Electronics won a five-year contract worth more than $200 billion to manufacture chips for Broadcom, running through 2030 and centered on Samsung's 2-nanometer and below process technology. The agreement covers Broadcom's next generation of AI accelerators and includes advanced packaging work, specifically 2.3D and 2.5D integration, intended to boost performance and power efficiency in AI and networking components. The deal was announced Saturday, July 25, 2026, timed to South Korean President Lee Jae Myung's visit to Silicon Valley for an AI summit that produced several other partnerships in parallel, including new Nvidia tie-ups with Korean search company Naver and memory maker SK Hynix. For Samsung, the order is a significant win in its rivalry with Taiwan Semiconductor Manufacturing Co. for advanced-node foundry business, an area where TSMC has historically held a commanding lead. Samsung and SK Hynix are both racing to expand memory and logic manufacturing capacity, with South Korea aiming to double its memory production capacity within five years as part of a broader national push to become a bigger supplier in the global AI chip race. The Broadcom win, alongside the summit's other announcements, underscores how central South Korean manufacturers have become to the infrastructure side of the AI buildout, even as the flashiest model and compute headlines tend to focus on the U.S. labs themselves.